Company Information
| Company Introduction : | The company's products including wafer bumping, tape carrier packaging (TCP), flip chip, wafer level CSP, gold bump, solder bump, chip on film. |
|---|---|
| Main Products : | electronic & electrical components- wafer bumping, tape carrier packaging ( TCP), flip chip, wafer level CSP, gold bumps, solder bumps, chip on films. |
| Business Nature : | Manufacturer |
| Year Established : | 1997 |
| Current Export Markets : | Worldwide |
Taiwan