Company Information
| Company Introduction : | Manufacturer of electronic materials, such as coverlay(CL), flexible copper cladded laminate (FCCL), coating, chip on film (COF), photo-imaginable-coverlay (PIC), adhesiveless- FCCL (2L-FCCL), chip on glass (COG), tape automatic bonding (TAB) for flexible printed circuit (FPC). |
|---|---|
| Main Products : | electronic materials- coverlay ( CL ), flexible copper cladded laminate ( FCCL ), coating, chip on film(COF), photo-imaginable-coverlay ( PIC ), adhesiveless- FCCL ( 2L- FCCL ), chip on glass ( COG ), tape automatic bonding ( TAB ) for flexible printed circuit ( FPC ). |
| Business Nature : | Manufacturer |
| Year Established : | 1997 |
| Current Export Markets : | Worldwide |
Taiwan