Contact us
| Company Name : | Tong Hsing Electronic Ind., Ltd. |
|---|---|
| Contact Person : | Mr. Ken Wu  |
| Country : |  Taiwan |
GGI Flip Chips ( MEMS Packaging)
Model : N/A1. MEMS packaging is a method of fabricating a package for a micro-electromechanical systems (MEMS) device. 2. SiP assembly, allowing for a simpler chip design requirement, lower cost, shorter time-to-market and better wafer yield, can be ...