Company Information
| Main Products : | integrated circuits ( IC design, OEM ODM), SMT, semiconductor manufacturing , embedded memory and design, wafer fabrication. testing- memory tester, logic tester, mixed tester, assembly- PLCC, DIP, SKINNY, SOP, SOJ, TSOP, QFP, TQFP, BGA wafer grinding- 6" wafer-down to 10 mil, 8" wafer-down to 10 mil , wafer probing (for memory, Logic and mixed ICs) packaging (QFP, SOP, BGA), and final testing. |
|---|
