1. Material: (1) Housing: see table, 30% G.F, UL94V-0; black. (2) Contact: phosphor bronze C5210R-EH T=0.30mm. 2. Plating: (1) Contact: gold over 50u min nickel, underplate, solder tail 150u min tin over. (2) Gold specification: a, G/F; b, ...
1. Appllcation: for memory stick card use only. 2. Material and flnish: (1) Contact area gold plating 15. (2) Contact: copper alloy. (3) Housing: LCP, glass fiber (UL 94V-0).
1. Appllcation: for memory stick card use only. 2. Material and flnish: (1) Contact area gold plating 15. (2) Contact: copper alloy. (3) Housing: LCP, glass fiber (UL 94V-0).
1. Appllcation: for memory stick card use only. 2. Material and flnish: (1) Contact area gold plating 15. (2) Contact: copper alloy. (3) Housing: LCP, glass fiber (UL 94V-0).
1. Application: for memory stick card use only. 2. Material and flnish: (1) Contact area gold plating 15. (2) Contact: copper alloy. (3) Housing: LCP, glass fiber (UL 94V-0).
1. Flex-rigid multilayer PCB. 2. Stiffemer: PI film, FR-4, PET film. 3. UL file No. E216543 (flame class: 94-V0, temperature index: 105°C.)
1. Single-sided FPC, double-sided FPC. 2. Stiffemer: PI film, FR-4, PET film. 3. UL file No. E216543 (flame class: 94-V0, temperature index: 105°C.)
1. Multilayer FPC. 2. Stiffemer: PI film, FR-4, PET film. 3. UL file No. E216543 (flame class: 94-V0, temperature index: 105°C.)
1. Cable entry: right angle lower contact easy on side entry smt slim type. 2. Ins. type: ZIF. 3. Solder mount: SMT.
Electrical: 1. Dielectric withstanding voltage: 1,000 VAC RMS. 2. Current rating: 3 Amp. 3. Insulation resistance: 5,000 megaohms min. at 500 VDC. 4. Contact resistance: 20 milliohms max.
| Company Name : | Almita Co., Ltd. |
|---|---|
| Contact Person : | Mr. Broman Tsai  |
| Address : | 5F, No. 188, Sec. 1, Hsin Tai Wu Rd., Hi |
| Country : |  Taiwan |
| Telephone : | 886-2-26418862 |
| Fax : | 886-2-26418896 |
