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Metal Etching For Cellular Phone 3C Components

Model : N/A

1. Purpose: can be customized. 2. Min. bore diameter-50μm. 3. Min. bore distance-70μm. 4. Max. size-650x730mm. 5. Available materials (still have other metal alloy metal)- SUS304 T =0.03, 0.05, 0.06, 0.08, 0.1, 0.15, 0.2, 0.5, 1.5mm.

    Taiwan Taiwan

Metal Etching For Shadow Masks

Model : N/A

1. Purpose: wafer, OLED deposition fixture. 2. Production capability. 3. Min. bore diameter-50μm. 4. Min. bore distance-70μm. 5. Max. size-600x700mm.

    Taiwan Taiwan