Thick Film Ceramic Substrates ( MEMS Packaging)
Model : N/A1. MEMS packaging is a method of fabricating a package for a micro-electromechanical systems (MEMS) device. 2. SiP assembly, allowing for a simpler chip design requirement, lower cost, shorter time-to-market and better wafer yield, can be applied to currently available chips. 3. IECQ manufacturer approval. 4. ISO-9002 certification. 5. QS-9000/ISO-9001 ...
Taiwan