Contact us
Company Name : | ChipSiP Technology Co., Ltd |
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Contact Person : | Ms. Fenny Chen ![]() |
Country : | ![]() |
Telephone : | 886-2-82271799 |
The CGPA10x is a complete navigation system built on a new SiRFstarIV and other specifications of key components for deriving highest performance in GPS application. These combinations are resulted in higher sensitivity, faster fist fix, system ...
ChipSiP introduces the highly integrated CWFA10x 802.11b/g/n WLAN communication applications. The CWFA10x is a system-in-a-package (SiP) product, which is highly integrated with RF front-end circuit, digitalized baseband circuit and a Bluetooth ...
CWMA101 is compliant with WiMAX 16e 2.3GHz ~2.7GHz HMC use GDM7205K SOC, including GCT’s direction conversion radio on-chip transceiver, provide a highly integrated, total solution for wireless multimedia communication over 802.16e WiMAX. It ...
To meet the current trend for slimmer digital still camera and camcorder with complex capabilities, CT48 is especially beneficial in a small dimension. ChipSiP offers various density of CT48 MCPs to satisfy space-saving and lighter-weighted ...
ChipSiP helps surveillance IC design house and system manufacture to integrate 3D noise reduction, video processing functions into a surveillance camera by SiP technology. Equipping with ChipSiP's SiP design, surveillance product can be promised ...
This new packaging solution, PoP (Package on Package), helps designers save space on digital camera design boards and shorten the interconnection distance between electric components, significantly improving performance. The integrated SiP ...
SIP (System in Package) is defined as one that typically encompasses more than one active electronic component plus optional passives and other devices such as MEMS, sensor, assembled into a single standard package. One of the main attributes of ...
It's is very important to manage product life cycle at consumer electronics market now. Manufacturers all expect to design new products with less cost and diversified ID as faster as possible. The idea of modulization can help designers easily ...
SiP (System in Package) is defined as one that typically encompasses more than one active electronic component plus optional passives and other devices such as MEMS, sensor, assembled into a single standard package. One of the main attributes of ...
CT42, CT43, CT7B MCPs feature quick-booting, high read rate and stable performance with slim size, which are perfect to be carried at convenience for wireless devices. Also, the advantages of space saving, light-weighted can miniaturize Wi-Fi ...
Company Name : | ChipSiP Technology Co., Ltd |
---|---|
Contact Person : | Ms. Fenny Chen ![]() |
Country : | ![]() |
Telephone : | 886-2-82271799 |