1. Designed specifically for thin carrier plates.
2. Equipped with a vacuum pump to suck up thin carrier plate.
3. Thin carrier plate are put on loading cassette manually. A robot hand pulls the plate into preparing position.
4. Loader: move the plate from load cassette to on vacuum plate.
5. Added heaters where are located in front of entrance and exit of loading and unloading mechanism.(Optional)
6. The vacuum plate, which has features of high steel rigidity and high accuracy, is designed to fit 0201or larger. The vacuum plate has the ability for X-axis rotation of 180 degrees.
7. If the chip specification is larger than 0603(1608) , the chip can be dipped two sides consecutively without transfer.
8. Remove falling down chips automatically.
9. Dipping and blotting are in the same place of the ink tray.
10. Dipping device equipped with automatic temperature controlling system (with ice cooling machine, optional).
1. Thin carrier plate system:
(1) Thin carrier plate: 280(L) x 180(W) m/m.
(2) Thin carrier plate designed for 0201. 0402. 0603. 0805~1206 chip sizes.
2. Machine dimensions: 870 L x 970 W x 1740 H (mm)(without warning light).
3. Weight: 610 kgs.
Taiwan
