The design of the wafer grinding machine is basically inheriting the work principle of a vertical grinding machine. A diamond grinding wheel is fitted to the air floating spindle. The wafer grinding machine performs vertical grinding on hard and brittle workpieces requiring rigorous surface accuracy and flatness. One evident example is the use of water surface grinding during semi-conductor processes. This process will decide the minimum sizes for wafer sealing and system sealing. In fact, the rigorous requirements for surface flatness and roughness in wafer surface grinding can be achieved only by a specially design ed wafer grinding machines.
The machine employs an air floating spindle fitted with a diamond grinding wheel-the water is sucked onto an air floating table.
General capacity:
1. Max. grinding length: 500 mm (20").
2. Max. grinding width: 250 mm (10").
3. Table working surface: 250 x 500 mm (10"x20").
4. Max. distance from table surface to spindle centerline: 470 mm (18.8").
Taiwan
