Features
1. Coaxial-driven chuck stage.
2. RF probing field upgradable.
3. 20X~4000X magnification.
4. Backlash-free movement.
5. Platen linear quick up/down.
6. Easy load/unload wafer.
7. Platen linear fine up/down.
8. Probe card tip overdrive adjustment.
1. Specifications:
(1) Vacuum chuck 6" stainless steel.
(2) Chuck stage 6" x6" travel.
(3) Chuck theta 0~30 degree.
(4) Platen up/down.
(5) Coarse adjustment 6mm adjustable.
(6) Lever-driven.
(7) Platen up/down.
(8) Fine adjustment 25 mm adjustable.
(9) Hand wheel-driven.
(10) Platen 12 Micropositioner.
(11) Microscope stage 1" x 1" travel.
2. Dimensions:
(1) 780mmW x 660mmD x 700mmH with Microscope.
(2) Weight 80 Kg with Microscope.
3. Requirements:
(1) Electrical 110 VAC, 60Hz.
(2) Vacuum -250 mmHg, 7 liter/min.
4. Accessories:
(1) Wafer chuck pull-out stage.
(2) Miroscope tilting mechanism.
(3) RF prone/cables.
(4) Active probes.
(5) Low current/capacitance probes.
(6) High voltage probe.
(7) Laser cutter.
(8) Ultrasonic cutter.
(9) CCTV.
(10) Photomicrographics.
(11) Probe card holder.
(12) Packaged device holder.
(13) PCB holder.
(14) Thermal systems.
(15) Liquid crystal kit.
(16) Vibration free table.
(17) Shielding box.
(18) Test bench.
(19) Instrument case with caster.
(20) Dark field/Normarski inspection.
(21) Chuck vacuum pattern.
(22) Gold plated chuck.
Taiwan
