BPC-5070, Skylake-S Compact Embedded Computer

Product Name :
BPC-5070, Skylake-S Compact Embedded Computer
Model No :
list_dot_01.png7th/6th Gen. Intel® Core™ Processor up to 3.4 GHz
list_dot_01.pngSupports up to Triple Independent Displays
list_dot_01.pngBPC-5070-1A1 Supports RAID 0 / 1
list_dot_01.png-20 ~ 60°C Operating Temperature

Model BPC-5070-1A1 BPC-5070-2A1
Processor System CPU Socket LGA 1151 for Intel® Core™ i7/i5/i3/Celeron (Skylake-S)
Frequency N/A
System Chipset Intel® Q170 Intel® H110
Cache N/A
Memory Technology Dual-Channel DDR4 2133 MHz SDRAM
Max. Capacity 32 GB
Type 2x (260-pin SO-DIMM)
Display Graphics Engine Intel® Gen9 Graphics DX 11/12, OGL 4.3/4.4
HDMI 1: up to 4096 x 2160 @ 60 Hz
HDMI 2 & 3: up to 4096 x 2160 @ 30 Hz
2x HDMI, up to 4096 x 2160 @ 24 Hz
VGA 1x VGA, up to 1920 x 1200 @ 60 Hz
Front I/O Interface USB 4x USB 2.0
Serial Port 2x RS-232/422/485
Ethernet N/A
Audio N/A
Antenna Hole N/A
Others N/A
Rear I/O Interface USB 4x USB 3.0
Serial Port N/A
Ethernet 2x GbE (LAN 1:Intel® I219LM, LAN 2:Intel® I210) 2x GbE (LAN 1: Intel® I219V, LAN 2: Intel® I210)
Audio Line Out, Mic In (Realtek ALC887/897 HD)
Antenna Hole 2
Others N/A
Storage 2.5" HDD / SSD 2x SATA III (6.0 Gb/s), (7 mm 2.5” HDD Only)
M.2 N/A
mSATA 1x mSATA (Mux with mini-PCIe Full Size) 1x mSATA
Expansion Mini PCIe 1x Full Size (PCIe x1, SATA III (mSATA), & USB 2.0)
1x Half Size (PCIe x1 & USB 2.0)
1x Half Size (PCIe x1 & USB 2.0)
M.2 N/A
SIM Holder N/A
Power Power Mode AT / ATX
Power Supply Voltage 12/19~24V DC Input
Connector Type Phoenix Connector
Power Consumption (Typical) 0.8 A @ 12 V (9.5W)
Mounting Type Wall Mount
Environment Operating Temperature -20~60°C (-4~122° F) (Humidity: 60°C @ 80% RH Non-condensing) w/ Extended Temp. RAM & M.2 SSD
Storage Temperature -40~75°C and 60°C @ 95% RH Non-condensing
Humidity 5~95% @ 40°C, Non-condensing
Vibration 1 Grms, IEC 60068-2-64, Random, 5~500 Hz, 1 Oct/min., 1hr/axis, x, y, z 3 axes
Shock 20 G, IEC 60068-2-27, Half Sine, 11 ms Duration
General Certification CE, FCC Class A
Thermal Dissipation Fanless System
Material Extruded Aluminum
Dimensions (W x H x D) 238 x 61 x 245 mm (9.37” x 2.40” x 9.64”)
Net Weight 3 kg (6.6 lb)
Operating System Windows 7/8.1/10, WES7-E/P, Ubuntu 14.04
list_dot_01.pngEmbedded Digital Signage Control Systems
list_dot_01.pngFactory Automation
list_dot_01.pngImage Processing
list_dot_01.pngTransportation Management
list_dot_01.pngMachine Automation

Ordering Information

Part No. Description
BPC-5070-1A1 Intel® Core™ i LGA1151 CPU, Q170, 4x USB3.0, 4x USB2.0, 2x RS-232/422/485, 2x GbE, 3x HDMI, 1x VGA, RAID 0/1, DC 12/19~24V, Phoenix Connector
BPC-5070-2A1 Intel® Core™ i LGA1151 CPU, H110, 4x USB3.0, 4x USB2.0, 2x RS-232/422/485, 2x GbE, 2x HDMI, 1x VGA, DC 12/19~24V, Phoenix Connector

Packing List

1x BPC-5070
1x Power Adapter
1x Power Cord

Optional Items

Part No. Description
AWD-WF001 Wi-Fi 802.11 b/g/n (1T1R) + 1 Antenna, Half Size
AWD-WF003 Wi-Fi 802.11 a/b/g/n/ac/BT4.0 (2T2R) + 2 Antennas (Dual Band), Half Size
i7-6700TE Intel® 6th Gen Core™ i7-6700TE (8M Cache, 2.40 up to 3.4 GHz)
i7-7700T Intel® 7th Gen Core™ i7-7700T (8M Cache, 2.90 up to 3.8 GHz)
i5-7500T Intel® 7th Gen Core™ i5-7500T (6M Cache, 2.70 up to 3.30 GHz)
i5-6500TE Intel® 6th Gen Core™ i5-6500TE (6M Cache, 2.30 up to 3.30 GHz)
i3-6100TE Intel® 6th Gen Core™ i3-6100TE (4M Cache, 2.70 GHz)

Contact us

Company Name :Arestech
Contact Person :Mr. Richard Hung
Address :4F., No.53, Xingai Rd., Neihu Dist.,
City :Taipei
Country :Taiwan Taiwan
Website :
Telephone :86-02-27901930