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Polyester Film Capacitors ( Inductive)

Model : PEI

PEI are inductively wound with polyester film dielectric and aluminum foil as the electrode with copper-clad steel leads and epoxy resin coated. They are suitable for blocking, by-pass and coupling in timing circuits and filters. They are ideal for application in TV, radio, tape-recorder, stereo and other consumer electronic equipment.

    Taiwan Taiwan

Metalized Polyester Film Capacitors

Model : MEF

MEF are constructed with metalized polyester film dielectric, copperply lead and epoxy resin coating. They are suitable for blocking, coupling, decoupling, filtering, bypass timing circuit and ideal for use in telecommunication equipments, data processinn equipments, industrial instruments, automatic control system.

    Taiwan Taiwan

LHE Blown Film Extrusion Machines

Model : N/A

1.Driving motor be controlled by inverter increasing 15% capacity. 2.In line designed, occupies little space, easy to operate, easy to manage. 3.Low electricity consumption, high-efficiency.

    Taiwan Taiwan

Polymer Film

Model : Model A402

- Duplex center/surface winding good for narrow slit applications

    Taiwan Taiwan

Metallized Polypropylene Film Capacitors

Model : MPX

1. Voltage range: 275VAC. 2. OEM and ODM custom design are accepted.

    Taiwan Taiwan

Metalized Polyester Film Capacitors ( Mini Boxes)

Model : MSC

MSC are non-inductively wound with metalized polyester as dielectric/ electrode with copper-clad steel leads with epoxy resin coating. They are suitable for blocking, filitering, by-pass, coupling, decoupling and timing circuits with application in telecommunication, data processing, industrial instruments and automatic control system equipments.

    Taiwan Taiwan

Film Capacitors

Model : N/A

We can modify the design and production of webbing by clients’ demands to raise its values.

    Taiwan Taiwan

Thick Film Chip Resistors

Model : N/A

Features: Used for various types of electronic parts.

    Taiwan Taiwan

Thick Film Ceramic Substrates ( MEMS Packaging)

Model : N/A

1. MEMS packaging is a method of fabricating a package for a micro-electromechanical systems (MEMS) device. 2. SiP assembly, allowing for a simpler chip design requirement, lower cost, shorter time-to-market and better wafer yield, can be applied to currently available chips. 3. IECQ manufacturer approval. 4. ISO-9002 certification. 5. QS-9000/ISO-9001 ...

    Taiwan Taiwan

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